ASSEMBLY PACKAGING DEVELOPMENT ENGINEER (m/f/d)

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. 

Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems.

As an Assembly Packaging Development Engineer (m/f/d) in our Bevaix competence Center, you’ll be responsible for:

• Providing expertise and leadership in the MEMS package design process


• Conducting materials selection and manage assembly process


• Evaluating designs and apply changes when and if necessary


• Testing and statistical analysis of results


• Close interaction with manufacturing sites and clients

 

What your background should look like: 

• MS or Ph.D. in Mechanical Engineering, Materials Science, Physics, or similar disciplines.


• At least 5 years of experience with SOIC, LGA, QFN, WLCSP, and flip-chip packages.  Knowledge of substrate & lead-frame materials, as well as manufacturing, is a plus.


• Knowledge of JEDEC standards for package-level integrity/reliability stress tests requirements.


• Fluent English skills, experience in a fast-paced international working environment


• Experience in the sensor-field will be considered a plus

Competencies

Values: Integrity, Accountability,Teamwork, Innovation

About TE Connectivity
TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications and the home. With approximately 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.

 

What TE Connectivity offers:

We offer competitive rewards & compensation. Our commitment to our employees includes offering benefit programs that are comprehensive, competitive and will meet the needs of our employees.
•    Competitive Salary Package
•    Performance-Based Bonus Plans
•    Health and Wellness Incentives
•    Employee Stock Purchase Program
•    Community Outreach Programs / Charity Events
•    Employee Resource Groups

Location: 

BEVAIX, NE, CH, 2022

City:  BEVAIX State:  NE Country/Region:  CH Travel:  Less than 10% Requisition ID:  71422 Alternative Locations:  Function:  Engineering & Technology

Job Segment: Package Design, Assembly, Engineer, Developer, Manufacturing Engineer, Manufacturing, Engineering, Technology