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Electronic Packaging Engineer

Inseriert am: 02.03.2020











































In a life without sound, our work provides meaning. As the world’s leading hearing care provider, we are not just a company that makes products: we are a team on a mission to help people enjoy the delight of hearing. To enable a life without limitations, we – through our core brands Phonak, Unitron, Hansaton, Advanced Bionics and AudioNova – develop, manufacture and distribute solutions that push the limits of technology and redefine the future of our industry.

Sonova has more than 14,000 committed employees in over 100 countries, all of whom contribute to something greater than themselves – they transform lives. Join our mission and become part of our team! Apply now for the following position:
Sonova / Switzerland / Stäfa
Electronic Packaging Engineer
The Research & Development group is responsible to develop the microsystems we use in our Hearing Instruments. This microelectronic package, we call it hearing aid “hybrid”, it is a key part of the hearing instrument. In this position you develop and industrialize microelectronic packaging solutions for our microsystems. Therefore, you will work and interact with several internal and external teams within our Research & Development, Production and Manufacturing Engineering department.

Your tasks


  • Project lead for packaging industrialization

  • Develop microelectronic packages from conceptual design to realization in final products

  • PCB layout in collaboration with Research & Development and Production teams

  • Design and verification of flip chip packaging technologies in collaboration with external partners and the Process Development

  • Market screening of future PCB/packaging technologies

  • Analyze and resolve electronic packaging problems including 3D FEM Analysis of thermomechanical stress

  • Maintenance of PCB project libraries for Platform components as well as creation and maintenance of production documents

Your profile


  • Degree in microsystems technology, microelectronics or equivalent, for example mechanical or process development, further education in electronic packaging technology or PCB technology & layout

  • At least 3 years’ experience in a similar role, and experienced in FEM analysis is an advantage

  • Analytical and networked thinking with a methodical approach

  • Ability to work independently and conscientiously on interdisciplinary thematic field with high solution orientation

  • Proficient in English, advanced German is a plus

Our offer
We can offer you a new challenge, with interesting tasks and much more – including an open corporate culture, flat hierarchies, support for further training and development, opportunities to take on responsibility, an excellent range of foods, sports and cultural facilities, attractive employment conditions, and flexible working time models in various roles.
Gianni Raffi, Senior Talent Acquisition Manager, is looking forward to receiving your complete application (cover letter, CV, references and certificates) via our online job application platform.

For this vacancy only direct applications will be considered.
Sonova AG
Laubisrütistrasse 28
CH-8712 Stäfa
+41 58 928 01 01
Create impact. Transform lives – sonova.com/careers





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