• Developing of innovative digital architectures for 3D image sensors design with a high degree of independence
• Develop digital solutions for on-chip data handling, FPGA-based modelling of the complete sensor architecture
• Develop innovative solutions for design verification for complex SoC featuring SW-on-top, multi-core processing and mixed-signal circuits
• Digital, Analog/Mixed-Signal Circuit design, simulation and verification of complex system-on-chip
• Support to layout design and IC characterization during debugging of developed IPs
• Provide comprehensive design specification documentation
• Simulations and modelling of complete digital architecture, with SW-on-top, performance prediction and optimization of system parameters
• Play a key role in defining next-generation 3D imaging products
As a member of our team, the candidate will have a wide and varying set of responsibilities as our organization grows and evolves. These may include: • Work with cross-functional team on the development of highly innovative 3D imaging systems for mobile market • Contributing to the ongoing creation of a positive, productive work environment
Your education and experiences
Candidates must have more than 4 years of hands-on experience in developing digital architectures/circuits/solutions preferably for imaging systems, familiarity with large ICs/system-on-chip specifications, architectures and designs including direct experience in converting customer requirements into detailed digital technical specifications.
• Master/PhD in Electronic Engineering or a similar discipline
• Strong experience and background in Digital IC design, preferably in the field of image sensors/sensors
• Solid experience in digital IC design and simulations SW tools (Cadence, Synopsys)
• Profound understanding of RTL design in VHDL, simulation, synthesis, and place & route of digital building blocks
• Knowledge of the whole IC design flows would be an advantage: IC architecture design and simulations, IPs selection, RTL design, functional verification, low-power/small-area design, physical design, device validation, characterization and qualification.
• Familiarity with on-chip bus architectures, embedded processors, software and hardware debug support and modelling data flows at the chip level including mixed-signal circuits modelling
• Familiarity with the major semiconductor process nodes
• Experience in system design for 3D imaging systems and image sensors will be an advantage
